专利内容由知识产权出版社提供
专利名称：BONDING POLYMER MATERIAL TO
ANODIZED METAL USING CAVITIES
发明人：CURRAN, James A.,MINTZ, Todd S.,YANG,
Isabel,ZHANG, Shi Hua,MISRA,Abhijeet,HAMANN, Eric W.
申请号：EP18191706.3申请日：20180830公开号：EP3453510A1公开日：20190313
专利附图：
摘要：This application relates to a multi-piece enclosure for a portable electronic
device (102, 104, 106). The enclosure includes a metal part (240) including a metalsubstrate (204) and a metal oxide layer (206) overlaying the metal substrate (204), themetal oxide layer (206) having an external surface (202) that includes openings that leadinto undercut regions (WU). The openings are characterized as having a first width, andthe undercut regions (WU) are characterized as having a second width that is greater thanthe first width. The enclosure further includes a non-metallic bulk layer (252) includingprotruding portions that extend into the undercut regions (WU) such that the non-metallic bulk layer (252) is interlocked with the metal part (240).
申请人：Apple Inc.
地址：One Apple Park Way Cupertino, CA 95014 US
国籍：US
代理机构：Lang, Johannes
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