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专利名称：Flip chip type semiconductor device and
method of manufactruing the same
发明人：Takashi Miyazaki申请号：US098604申请日：20010525
公开号：US20010048166A1公开日：20011206
摘要：A flip chip type semiconductor device is provided with a semiconductor chip witha plurality of pad electrodes on one surface. A solder electrode is connected to each padelectrode and a metallic post is connected to each solder electrode. The surface of thesemiconductor chip on a side on which the pad electrodes are provided is coated with aninsulating resin layer and whole the pad electrode and solder electrode and part of themetallic post are buried in the insulating resin layer. The remaining portion of themetallic post is projected from the insulating resin layer to form a protrusion. Then, anouter solder electrode is formed so as to cover this protrusion. The outer solderelectrodes are arranged in a matrix on the insulating resin layer. The height of theprotrusion is made 7 to 50% of the distance between an end of the outer solderelectrode and the surface of the insulating resin layer.
申请人：MIYAZAKI TAKASHI
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