专利内容由知识产权出版社提供
专利名称：Integrated circuit package with a plurality of
vias that are electrically connected to aninternal ground plane and thermallyconnected to an external heat slug
发明人：Mark J. Palmer申请号：US08/575222申请日：19951220公开号：US05721454A公开日：19980224
摘要：An integrated circuit package which has vias that provide the dual function ofelectrically grounding an integrated circuit and removing heat generated by the circuit.The package has a bonding shelf extending from a base portion. The bonding shelf has aplurality of bonding pads that are connected to corresponding pads on a top surface ofthe integrated circuit. The integrated circuit is mounted to the base portion of thepackage. The base portion has a plurality of surface pads that are connected to
corresponding ground pads on the integrated circuit. Located between the base portionand an external bottom surface of the package is a ground bus. The package has aplurality of vias that electrically connect the surface pads and integrated circuit to theground bus. The vias further extend to the external bottom surface to provide a thermalpath between the integrated circuit and the outside of the package.
申请人：INTEL CORPORATION
代理机构：Blakely, Sokoloff, Taylor & Zafman
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