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专利名称：Electronic module with carrier substrates,
multiple integrated circuit (IC) chips andmicrochannel cooling device
发明人：Paul S. Andry,Evan G. Colgan申请号：US12134873申请日：20080606公开号：US08115302B2公开日：20120214
专利附图：
摘要：Apparatus and methods are provided for integrating microchannel coolingmodules within high-density electronic modules (e.g., chip packages, system-on-a-
package modules, etc.,) comprising multiple high-performance IC chips. Electronicmodules are designed such that high-performance (high power) IC chips are disposed inclose proximity to the integrated cooling module (or cooling plate) for effective heatextraction. Moreover, electronic modules which comprise large surface area siliconcarriers with multiple chips face mounted thereon are designed such that integratedsilicon cooling modules are rigidly bonded to the back surfaces of such chips to increasethe structural integrity of the silicon carriers.
申请人：Paul S. Andry,Evan G. Colgan
地址：Yorktown Heights NY US,Chestnut Ridge NY US
国籍：US,US
代理机构：F. Chau & Associates, LLC
代理人：Louis J. Percello
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