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专利名称：METHOD OF MANUFACTURING
CONNECTION STRUCTURE
发明人：Ryoji Kojima申请号：US14112277申请日：20120402
公开号：US20140226297A1公开日：20140814
专利附图：
摘要：A method of manufacturing a connection structure which includes a wiringsubstrate, a first electronic component that is flip-chip mounted on the front surfacethereof, and a second electronic component that is flip-chip mounted on the rear surface.
The method includes the steps of: temporarily mounting the first electronic componenton the front surface of the wiring substrate with a first adhesive film disposedtherebetween; temporarily mounting the second electronic component on the rearsurface of the wiring substrate with a second adhesive film disposed therebetween,placing, on a pressure bonding receiving base, the wiring substrate on which the firstelectronic component and the second electronic component are temporarily mounted;and mounting the first electronic component and the second electronic component at atime onto the respective front and rear surfaces of the wiring substrate.
申请人：Ryoji Kojima
地址：Tochigi JP
国籍：JP
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