专利内容由知识产权出版社提供
专利名称：Flexible substrate and electronic apparatus
equipped with same
发明人：Kengo Suzuki,Kouji Morimoto申请号：US14969585申请日：20151215公开号：US09706657B2公开日：20170711
专利附图：
摘要：A flexible board includes: a base film, on which a wiring pattern is formed; a firstcover film, which is located on one surface of the base film; and a second cover film, whichis located on the other surface of the base film. The bending portion, which is bent when
mounting the flexible board on an electronic apparatus, includes both edges on whichthe first cover film is formed and a central portion from which the base film is exposed.
申请人：KYOCERA Corporation
地址：Kyoto-shi, Kyoto JP
国籍：JP
代理机构：Procopio Cory Hargreaves and Savitch LLP
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