专利内容由知识产权出版社提供
专利名称：Package structure of organic
electroluminescent devices
发明人：Wen-Jeng Lan,Chien-Yuan Feng,Yuan-Chang
Tseng,Ting-Chou Chen,Sheng-HsuShih,Chien-Chih Chiang,Chih-Ping Lin
申请号：US11372019申请日：20060310
公开号：US20060202222A1公开日：20060914
专利附图：
摘要：A package structure of organic electroluminescent device comprises at least
one isolating wall and at least one squeeze-out channel provided under a package lid.The adhesive coating place and squeeze-out area as laminating are able to be defined inpackage process due to the isolating wall and squeeze-out channel provided, therefore,which is not only to prevent the adhesive squeezed out from package process to protectthe emitting element within the package lid, but also prevent the adhesive squeezing outof the package lid to the saw street to affect the further cutting process.
申请人：Wen-Jeng Lan,Chien-Yuan Feng,Yuan-Chang Tseng,Ting-Chou Chen,Sheng-HsuShih,Chien-Chih Chiang,Chih-Ping Lin
地址：Chu-Nan TW,Chu-Nan TW,Chu-Nan TW,Chu-Nan TW,Chu-Nan TW,Chu-NanTW,Chu-Nan TW
国籍：TW,TW,TW,TW,TW,TW,TW
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