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CD74ACT541SM资料

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元器件交易网www.cecb2b.com

Data sheet acquired from Harris SemiconductorSCHS285A – Revised November 1999The CD54/74AC540, -541, and CD54/74ACT540, -541 octalbuffer/line drivers use the RCA ADVANCED CMOS technology. TheCD54/74AC/ACT540 are inverting 3-state buffers having twoactive-LOW output enables. The CD54/74AC/ACT541 arenon-inverting 3-state buffers having two active-LOW output enables.The CD74AC540, -541, and CD74ACT540, -541 are supplied in20-lead dual-in-line plastic packages (E suffix) and in 20-leaddual-in-line small-outline plastic packages (M suffix). Both packagetypes are operable over the following temperature ranges: Industrial(–40 to +85°C) and Extended Industrial/Military (–55 to +125°C).The CD54AC540, -541, and CD54ACT540, -541, available in chipform (H suffix), are operable over the –55 to +125°C temperaturerange.LHZPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.Copyright © 1999, Texas Instruments IncorporatedPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•1元器件交易网www.cecb2b.com

MAXIMUM RATINGS, Absolute-Maximum Values:DC SUPPLY-VOLTAGE (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 to 6 VDC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mADC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mADC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V). . . . . . . . . . . . . . . . . . . . . . . ±50 mADC VCC OR GROUND CURRENT (ICC or IGND). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA*PACKAGE THERMAL IMPEDANCE, θJA (see Note 1):E package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/WM package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/WSTORAGE TEMPERATURE (Tstg). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to +150°CLEAD TEMPERATURE (DURING SOLDERING):At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°CUnit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . +300°C* For up to 4 outputs per device: add ±25 mA for each additional output.NOTE 1:The package thermal impedance is calculated in accordance with JESD 51.2POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com

POST OFFICE BOX 655303 DALLAS, TEXAS 75265•3元器件交易网www.cecb2b.com

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网www.cecb2b.com

nsPOST OFFICE BOX 655303 DALLAS, TEXAS 75265•5元器件交易网www.cecb2b.com

6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265元器件交易网www.cecb2b.com

PACKAGEOPTIONADDENDUM

www.ti.com

26-Sep-2005

PACKAGINGINFORMATION

OrderableDeviceCD54AC541F3ACD54ACT540F3ACD54ACT541F3ACD74AC540MCD74AC540ME4CD74AC541ECD74AC541EE4CD74AC541MCD74AC541M96CD74AC541M96E4CD74AC541ME4CD74AC541SMCD74AC541SM96CD74AC541SM96E4CD74ACT540ECD74ACT540MCD74ACT540M96CD74ACT540M96E4CD74ACT540ME4CD74ACT541ECD74ACT541EE4CD74ACT541MCD74ACT541M96CD74ACT541M96E4CD74ACT541ME4CD74ACT541SMCD74ACT541SM96

Status(1)ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEOBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEOBSOLETEACTIVE

PackageTypeCDIPCDIPCDIPSOICSOICPDIPPDIPSOICSOICSOICSOICSSOPSSOPSSOPPDIPSOICSOICSOICSOICPDIPPDIPSOICSOICSOICSOICSSOPSSOP

PackageDrawing

JJJDWDWNNDWDWDWDWDBDBDBNDWDWDWDWNNDWDWDWDWDBDB

PinsPackageEcoPlan(2)

Qty202020202020202020202020202020202020202020202020202020

1112525202025

TBDTBDTBDGreen(RoHS&noSb/Br)Green(RoHS&noSb/Br)

Pb-Free(RoHS)Pb-Free(RoHS)Green(RoHS&noSb/Br)

Lead/BallFinish

CallTICallTICallTICUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCallTICUNIPDAU

MSLPeakTemp(3)Level-NC-NC-NCLevel-NC-NC-NCLevel-NC-NC-NCLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-NC-NC-NCLevel-NC-NC-NCLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-NC-NC-NCLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-NC-NC-NCLevel-NC-NC-NCLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMCallTI

Level-1-260C-UNLIM

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)25

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)2025

Pb-Free(RoHS)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)25202025

Green(RoHS&noSb/Br)

Pb-Free(RoHS)Pb-Free(RoHS)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)25

Green(RoHS&noSb/Br)

TBD

2000Green(RoHS&

Addendum-Page1

元器件交易网www.cecb2b.com

PACKAGEOPTIONADDENDUM

www.ti.com

26-Sep-2005

OrderableDevice

Status(1)

PackageTypeSSOP

PackageDrawingDB

PinsPackageEcoPlan(2)

Qty

noSb/Br)

20

2000Green(RoHS&

noSb/Br)

Lead/BallFinish

MSLPeakTemp(3)

CD74ACT541SM96E4

(1)

ACTIVECUNIPDAULevel-1-260C-UNLIM

Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.

LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.

NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.

PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.

(2)

EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS)orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.

Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.

Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)

(3)

MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.

ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.

InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.

Addendum-Page2

元器件交易网www.cecb2b.com

元器件交易网www.cecb2b.com

元器件交易网www.cecb2b.com

元器件交易网www.cecb2b.com

MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**) 28 PINS SHOWN0,65280,380,22150,15MPLASTIC SMALL-OUTLINE0,250,095,605,008,207,40Gage Plane1A140°–ā8°0,250,950,55Seating Plane2,00 MAX0,05 MIN0,10PINS **DIMA MAX146,50166,50207,50248,502810,503010,503812,90A MIN5,905,906,907,909,909,9012,304040065/E 12/01NOTES:A.B.C.D.All linear dimensions are in millimeters.This drawing is subject to change without notice.Body dimensions do not include mold flash or protrusion not to exceed 0,15.Falls within JEDEC MO-150POST OFFICE BOX 655303 DALLAS, TEXAS 75265•元器件交易网www.cecb2b.com

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:ProductsAmplifiersData ConvertersDSPInterfaceLogicPower MgmtMicrocontrollers

amplifier.ti.comdataconverter.ti.comdsp.ti.cominterface.ti.comlogic.ti.compower.ti.commicrocontroller.ti.com

ApplicationsAudioAutomotiveBroadbandDigital ControlMilitary

Optical NetworkingSecurityTelephonyVideo & ImagingWireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

Copyright  2005, Texas Instruments Incorporated

www.ti.com/audiowww.ti.com/automotivewww.ti.com/broadbandwww.ti.com/digitalcontrolwww.ti.com/militarywww.ti.com/opticalnetworkwww.ti.com/securitywww.ti.com/telephonywww.ti.com/videowww.ti.com/wireless

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