ULTRA HIGH SPEED 16K x 4STATIC CMOS RAMS
FEATURES
Full CMOS, 6T Cell
High Speed (Equal Access and Cycle Times)– 10/12/15/20/25 ns (Commercial)– 12/15/20/25/35 (Industrial)– 15/20/25/35/45 ns (Military)
Low Power (Commercial/Military)– 715 mW Active – 12/15
– 550/660 mW Active – 20/25/35/45– 193/220 mW Standby (TTL Input)
– 83/110 mW Standby (CMOS Input) P4C188– 15 mW Standby (CMOS Input) (P4C188L Military)
Single 5V±10% Power SupplyData Retention with 2.0V Supply(P4C188L Military)Three-State Outputs
TTL/CMOS Compatible OutputsFully TTL Compatible Inputs
Standard Pinout (JEDEC Approved)– 22-Pin 300 mil DIP– 24-Pin 300 mil SOJ
– 22-Pin 290 x 490 mil LCC
DESCRIPTION
The P4C188 and P4C188L are 65,536-bit ultra high speedstatic RAMs organized as 16K x 4. The CMOS memoriesrequire no clocks or refreshing and have equal access andcycle times. Inputs and outputs are fully TTL-compatible.The RAMs operate from a single 5V±10% tolerance powersupply. With battery backup, data integrity is maintained forsupply voltages down to 2.0V. Current drain is typically 10µA from a 2.0V supply.
Access times as fast as 10 nanoseconds are available,permitting greatly enhanced system speeds. CMOS isutilized to reduce power consumption to a low 715mWactive, 193mW standby and only 5mW in the P4C188Lversion.
The P4C188 and P4C188L are available in 22-pin 300 milDIP, 24-pin 300 mil SOJ and 22-pin LCC packages provid-ing excellent board level densities.
FUNCTIONAL BLOCK DIAGRAMPIN CONFIGURATIONS
DIP (P3, D3, C3)LCC (L3)
For SOJ pin configuration, please see end of datasheet.
Document # SRAM112 REV A
1
Revised October 2005
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P4C188/188L
MAXIMUM RATINGS(1)
SymbolVCC
ParameterPower Supply Pin withRespect to GNDTerminal Voltage withRespect to GND(up to 7.0V)
Operating Temperature
Value–0.5 to +7–0.5 toVCC +0.5–55 to +125
UnitV
SymbolTBIASTSTGPTIOUT
ParameterTemperature UnderBias
Storage TemperaturePower DissipationDC Output Current
Value–55 to +125–65 to +150
1.050
Unit°C°CWmA
VTERMTA
V°C
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Grade(2)Military
AmbientTemperature
GND0V0V0V
VCC
5.0V ± 10%5.0V ± 10%5.0V ± 10%
CAPACITANCES(4)
VCC = 5.0V, TA = 25°C, f = 1.0MHzSymbolCINCOUT
ParameterInput CapacitanceOutput Capacitance
ConditionsTyp.UnitVIN = 0VVOUT = 0V
57
pFpF
–55°C to +125°C–40°C to +85°CIndustrial
0°C to +70°CCommercial
DC ELECTRICAL CHARACTERISTICS
Over recommended operating temperature and supply voltage(2)SymbolVIHVILVHCVLCVCDVOLVOHILIILO ISB
Parameter
Input High VoltageInput Low VoltageCMOS Input High VoltageCMOS Input Low Voltage
Input Clamp Diode VoltageVCC = Min., IIN = 18 mAOutput Low Voltage(TTL Load)
Output High Voltage(TTL Load)
Input Leakage CurrentOutput Leakage Current
IOL = +8 mA, VCC = Min.IOH = –4 mA, VCC = Min.VCC = Max. Mil.VIN = GND to VCC Com’l.VCC = Max., CE = VIH, Mil.VOUT = GND to VCC Com’l.
Standby Power SupplyCE ≥ VIH Mil.Current (TTL Input Levels)VCC = Max ., Ind./Com’l.
f = Max., Outputs OpenStandby Power SupplyCurrent
(CMOS Input Levels)
CE ≥ VHC Mil.VCC = Max., Ind./Com’l.f = 0, Outputs OpenVIN ≤ VLC or VIN ≥ VHC
2.4–10–5–10–5____________
+10+5+10+540352015
Test Conditions
P4C188MinMax2.2VCC +0.5–0.5(3)–0.5(3)
0.80.2–1.20.42.4–5
n/a–5n/a____________
+5n/a+5n/a40n/a2.7n/a
P4C188L
Unit
MinMax2.2VCC +0.5V–0.5(3)–0.5(3)
0.80.2–1.20.4
VVVVVVµAµAmA
VCC –0.2VCC +0.5VCC –0.2VCC +0.5
ISB1
mA
n/a = Not Applicable
Notes:
1.Stresses greater than those listed under MAXIMUM RATINGS maycause permanent damage to the device. This is a stress rating onlyand functional operation of the device at these or any other conditionsabove those indicated in the operational sections of this specificationis not implied. Exposure to MAXIMUM rating conditions for extendedperiods may affect reliability.
2.Extended temperature operation guaranteed with 400 linear feet perminute of air flow.
3.Transient inputs with VIL and IIL not more negative than –3.0V and–100mA, respectively, are permissible for pulse widths up to 20 ns.4.This parameter is sampled and not 100% tested.
Document # SRAM112 REV APage 2 of 12
P4C188/188LPOWER DISSIPATION CHARACTERISTICS VS. SPEED
Symbol
Parameter
Temperature
RangeCommercial
ICC
Dynamic Operating Current*
IndustrialMilitary
–10180N/AN/A
–12170180N/A
–15160170170
–20155160160
–25150155155
–35N/A150150
–45N/AN/A145
UnitmAmAmA
*VCC = 5.5V. Tested with outputs open. f = Max. Switching inputs are 0V and 3V. CE = VIL
DATA RETENTION CHARACTERISTICS (P4C188L Military Temperature Only)
SymbolVDRICCDRtCDRtR†
Parameter
VCC for Data RetentionData Retention CurrentChip Deselect toData Retention TimeOperation Recovery Time
CE ≥ VCC –0.2V,VIN ≥ VCC –0.2V orVIN ≤ 0.2VTest Conditions
Min2.0
10
0tRC§
15
600
900
Typ.*VCC =
2.0V 3.0V
MaxVCC = 2.0V 3.0V
UnitVµAnsns
*TA = +125°C
§†
tRC = Read Cycle Time
This parameter is guaranteed but not tested.
DATA RETENTION WAVEFORM
Document # SRAM112 REV APage 3 of 12
P4C188/188L
AC CHARACTERISTICS—READ CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
Sym.tRCtAAtACtOHtLZtHZtPUtPD
Parameter
-10
12101022
50
10
022
-12
151212
226
012
-15
201515
236
015
-20
252020
238
0
20
-25
352525
2310
025
-35
453535
23
20
0
35
-45
MinMaxMinMaxMinMaxMinMaxMinMaxMinMaxMinMax
4545
Unitnsnsnsnsns
Read Cycle Time10Address AccessTimeChip EnableAccess TimeOutput Hold fromAddress ChangeChip Enable toOutput in Low ZChip Disable toOutput in High ZChip Enable toPower Up TimeChip Disable toPower DownTime
25nsns
45ns
TIMING WAVEFORM OF READ CYCLE NO. 1(5)
TIMING WAVEFORM OF READ CYCLE NO. 2(6)
Notes:
5.CE is LOW and WE is HIGH for READ cycle.
6.WE is HIGH, and address must be valid prior to or coincident with CEtransition LOW.
7.Transition is measured ±200mV from steady state voltage prior tochange with specified loading in Figure 1. This parameter is sampledand not 100% tested.
8.Read Cycle Time is measured from the last valid address to the firsttransitioning address.
Document # SRAM112 REV APage 4 of 12
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P4C188/188LAC CHARACTERISTICS - WRITE CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)Sym.tWCtCW
ParameterWrite Cycle TimeChip EnableTime to
End of WriteAddress Validto End of WriteAddressSet-up TimeWrite PulseWidthAddress HoldTime fromEnd of WriteData Valid toEnd of WriteData HoldTimeWrite Enableto Output inHigh ZOutput Activefrom Endof Write
2-10107
128-12
1310-15
2013-20
2515-25
3525-35
4535-45
MinMaxMinMaxMinMaxMinMaxMinMaxMinMaxMinMax
Unitnsns
tAWtAStWPtAH
7080
8090
100100
150130
200150
250250
350350
nsnsnsns
tDWtDHtWZ
50
5
60
6
70
6
80
8
100
10
150
15
205
20
nsnsns
tDW
222233ns
TIMING WAVEFORM OF WRITE CYCLE NO. 1 (WE CONTROLLED) (9)
Notes:
9.CE and WE must be LOW for WRITE cycle.
10.If CE goes HIGH simultaneously with WE HIGH, the output remains
in a high impedance state.
11.Write Cycle Time is measured from the last valid address to the first
transition address.
12.Transition is measured ±200mV from steady state voltage prior to
change with specified loading in Figure 1. This parameter issampled and not 100% tested.
Document # SRAM112 REV APage 5 of 12
P4C188/188L
TIMING WAVEFORM OF WRITE CYCLE NO. 2 (CE CONTROLLED)(9)
AC TEST CONDITIONS
Input Pulse LevelsInput Rise and Fall TimesInput Timing Reference LevelOutput Timing Reference LevelOutput Load
GND to 3.0V
3ns1.5V1.5V
See Figures 1 and 2
TRUTH TABLE
ModeStandbyReadWrite
CEHLL
WEXHL
OutputHigh ZDOUTDIN
PowerStandbyActiveActive
Figure 1. Output Load
* including scope and test fixture.
Note:
Because of the ultra-high speed of the P4C188/L, care must be takenwhen testing this device; an inadequate setup can cause a normalfunctioning part to be rejected as faulty. Long high-inductance leads thatcause supply bounce must be avoided by bringing the VCC and groundplanes directly up to the contactor fingers. A 0.01 µF high frequency
Figure 2. Thevenin Equivalent
capacitor is also required between VCC and ground. To avoid signalreflections, proper termination must be used; for example, a 50Ω testenvironment should be terminated into a 50Ω load with 1.73V (TheveninVoltage) at the comparator input, and a 116Ω resistor must be used inseries with DOUT to match 166Ω (Thevenin Resistance).
Document # SRAM112 REV APage 6 of 12
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P4C188/188LORDERING INFORMATION
1513 10
SELECTION GUIDE
The P4C188/L is available in the following temperature, speed and package options. The P4C188L is only availableover the Military Temperature range.
Temperature RangeCommercialIndustrialMilitary TemperatureMilitary Processed*PackagePlastic DIPPlastic SOJPlastic DIPPlastic SOJSide Brazed DIPCERDIPLCCSide Brazed DIPCERDIPLCCSpeed (ns)10-10PC-10JCN/AN/AN/AN/AN/AN/AN/AN/A12-12PC-12JC-12PI-12JIN/AN/AN/AN/AN/AN/A15-15PC-15JC-15PI-15JI-15CM-15DM-15LM-15CMB-15DMB-15LMB20-20PC-20JC-20PI-20JI-20CM-20DM-20LM-20CMB-20DMB-20LMB25-25PC-25JC-25PI-25JI-25CM-25DM-25LM-25CMB-25DMB-25LMB35-35PC-35JC-35PI-35JI-35CM-35DM-35LM-35CMB-35DMB-35LMB4545PC-45JC-45PI-45JI-45CM-45DM-45LM-45CMB-45DMB-45LMB* Military temperature range with MIL-STD-883, Class B processing.N/A = Not Available
Document # SRAM112 REV APage 7 of 12
P4C188/188L
SOJ PIN CONFIGURATION
SOJ (J4)
Document # SRAM112 REV APage 8 of 12
Pkg #C3# Pins22 (300 mil)SymbolMinMaxA0.1000.200b0.0140.023b20.0300.060C0.0080.015D1.0501.260E0.2600.310eA0.300 BSCe0.100 BSCL0.1250.200Q0.0150.070S10.005-S20.005-Pkg #D3# Pins22 (300 mil)SymbolMinMaxA-0.225b0.0150.020b20.0450.065C0.0090.012D1.0601.110E0.2900.320eA0.300 BSCe0.100 BSCL0.1250.200Q0.0150.060S10.005-α0°15°Document # SRAM112 REV AP4C188/188LSIDE BRAZED DUAL IN-LINE PACKAGE
Page 9 of 12
P4C188/188L
Pkg #J4# Pins24 (300 mil)SymbolMinMaxA0.1280.148A10.082-b0.0160.020C0.0070.010D0.6200.630e0.050 BSCE0.335 BSCE10.2920.300E20.267 BSCQ0.025-Pkg #L3# Pins22SymbolMinMaxA0.0600.080A10.0500.068B10.0220.028D0.2840.296D10.150 BSCD20.075 BSCD3-0.296E0.4840.496E10.300 BSCE20.150 BSCE3-0.496e0.050 BSChR = .012jR = .012L0.0390.051L10.0390.051L20.0580.072ND4NE7Document # SRAM112 REV ASOJ SMALL OUTLINE IC PACKAGE
Page 10 of 12
Pkg #P3# Pins22 (300 Mil)SymbolMinMaxA-0.210A10.015-b0.0140.022b20.0450.070C0.0080.014D1.1451.165E10.2400.280E0.3000.325e0.100 BSCeB-0.430L0.1150.150α0°15°Document # SRAM112 REV APLASTIC DUAL IN-LINE PACKAGE
P4C188/188LPage 11 of 12
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P4C188/188L
REVISIONS
DOCUMENT NUMBER:DOCUMENT TITLE:REV.ORA
ISSUEDATE1997Oct-05
SRAM112
P4C188 / P4C188L ULTRA HIGH SPEED 16K x 4 STATIC CMOS RAMS
ORIG. OFCHANGEDABJDB
DESCRIPTION OF CHANGENew Data SheetChange logo to Pyramid
Document # SRAM112 REV APage 12 of 12
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