P4C174
HIGH SPEED 8K x 8
CACHE TAG STATIC RAM
FEATURES
High Speed Address-To-Match - 8 ns MaximumAccess Time
High-Speed Read-Access Time– 8/10/12/15/20/25 ns (Commercial)– 15/20/25 ns (Military)Open Drain MATCH OutputReset Function
8-Bit Tag Comparison Logic
Automatic Powerdown During Long Cycles
Data Retention at 2V for Battery BackupOperation
Advanced CMOS TechnologyLow Power Operation
Package Styles Available — 28 Pin 300 mil DIP
— 28 Pin 300 mil Plastic SOJSingle Power Supply — 5V±10%
DESCRIPTION
The P4C174 is a 65,536 bit high speed cache tag staticRAM organized as 8K x 8. The CMOS memory has equalaccess and cycle times. Inputs are fully TTL-compatible.The cache tag RAMs operate from a single 5V±10%power supply. An 8-bit data comparator with a MATCHoutput is included for use as an address tag comparatorin high speed cache applications. The reset functionprovides the capability to reset all memory locations to aLOW level.
The MATCH output of the P4C174 reflects the compari-son result between the 8-bit data on the I/O pins and
the addressed memory location. 8K Cache lines can bemapped into 1M-Byte address spaces by comparing 20address bits organized as 13-line address bits and 7-page address bits.
Low power operation of the P4C174 is enhanced byautomatic powerdown when the memory is deselected orduring long cycle times. Also, data retention is main-tained down to VCC = 2.0. Typical battery backup appli-cations consume only 30 µW at VCC = 3.0V.
FUNCTIONAL BLOCK DIAGRAMPIN CONFIGURATION
DIP (C5, P5), SOJ (J5)Document # SRAM118 REV C
1
Revised August 2006
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P4C174
MAXIMUM RATINGS(1)
SymbolVCC
ParameterPower Supply Pin withRespect to GNDTerminal Voltage withRespect to GND(up to 7.0V)
Operating Temperature
Value–0.5 to +7–0.5 toVCC +0.5–55 to +125
UnitV
SymbolTBIASTSTGPTIOUT
ParameterTemperature UnderBias
Storage TemperaturePower DissipationDC Output Current
Value–55 to +125–65 to +150
1.050
Unit°C°CWmA
VTERMTA
V°C
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Grade(2)CommercialCommercial
AmbientTemperature0°C to +70°C0°C to +70°C
GND0V0V
VCC
5.0V ± 10%5.0V ± 10%
CAPACITANCES(4)
VCC = 5.0V, TA = 25°C, f = 1.0MHzSymbolCINCOUT
ParameterInput CapacitanceOutput Capacitance
ConditionsTyp.UnitVIN = 0VVOUT = 0V
57
pFpF
DC ELECTRICAL CHARACTERISTICS
Over recommended operating temperature and supply voltage(2)SymbolVIHVILVHCVLCVCDVOLVOHILIILO ISB
Parameter
Input High VoltageInput Low VoltageCMOS Input High VoltageCMOS Input Low Voltage
Input Clamp Diode VoltageVCC = Min., IIN = 18 mAOutput Low Voltage(TTL Load)
Output High Voltage(TTL Load)
Input Leakage CurrentOutput Leakage Current
IOL = +8 mA, VCC = Min.IOH = –4 mA, VCC = Min.VCC = Max. Com’l.VIN = GND to VCC Mil.VCC = Max., CE = VIH, Com’l.VOUT = GND to VCC Mil.
CE ≥ VIH Com’l.Standby Power Supply
Current (TTL Input Levels)VCC = Max ., Mil.
f = Max., Outputs OpenStandby Power SupplyCurrent
(CMOS Input Levels)
CE ≥ VHC Com’l.VCC = Max.,
f = 0, Outputs Open Mil.VIN ≤ VLC or VIN ≥ VHC
2.4–5-10–5-10____________
+5+10+5+102540525
mA
Test Conditions
P4C174MinMax2.2–0.5(3)–0.5(3)
VCC +0.50.80.2–1.20.4
UnitVVVVVVVµAµA
VCC –0.2VCC +0.5
ISB1
mA
n/a = Not Applicable
Notes:
1.Stresses greater than those listed under MAXIMUM RATINGS maycause permanent damage to the device. This is a stress rating onlyand functional operation of the device at these or any other conditionsabove those indicated in the operational sections of this specificationis not implied. Exposure to MAXIMUM rating conditions for extendedperiods may affect reliability.
2.Extended temperature operation guaranteed with 400 linear feet perminute of air flow.
3.Transient inputs with VIL and IIL not more negative than –3.0V and–100mA, respectively, are permissible for pulse widths up to 20 ns.4.This parameter is sampled and not 100% tested.
Document # SRAM118 REV CPage 2 of 12
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P4C174
DATA RETENTION CHARACTERISTICS (P4C174 Military Temperature Only)
SymbolVDRICCDRtCDRtR†
*TA = +25¹C
§tRC = Read Cycle Time
†
Parameter
VCC for Data RetentionData Retention CurrentChip Deselect toData Retention TimeOperation Recovery Time
Test ConditonsMin2.0
Typ.*VCC = 2.0V 3.0VMaxVCC = 2.0V 3.0V
UnitV
CE ≥ VCC –0.2V,VIN ≥ VCC –0.2Vor VIN ≤ 0.2V
0tRC§
1015600900µAnsns
This parameter is guaranteed but not tested.
DATA RETENTION WAVEFORM
POWER DISSIPATION CHARACTERISTICS VS. SPEED
SymbolICC
Parameter
Dynamic Operating Current*
TemperatureRange
CommercialMilitary
–8200
–10180
–12170
170–15
–20155160
–25150155
UnitmAmA
*VCC = 5.5V. Tested with outputs open. f = Max. Switching inputs are 0V and 3V. CE = VIL, OE = VIH.
Document # SRAM118 REV CPage 3 of 12
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P4C174
AC CHARACTERISTICS—READ CYCLE
(VCC = 5V ± 10%, All Temperature Ranges)(2)
SymboltRCtAAtOHtACtLZtHZtOEtOLZtOHZtPU
ParameterRead Cycle TimeAddress AccessTime
Address Change toOutput ChangeChip Enable LOW toOutput ValidChip Enable LOWto Output LOW-Z (1)Chip Enable HIGHto Output HIGH -Z (1)Output Enable LOWto Output ValidOutput Enable LOWto Output LOW-Z (1)Output Enable HIGHto Output HIGH -Z (1)Chip Enable LOW orAddress Change toPowerupPowerup toPowerdown
–8MinMax8
83
83
550
50
003310
–10
1210
3
10
356
05
0
–12Max12
3
12
356
05
015
–15MinMax
15
3
15
388
05
020
–20Min
2520
3
20
3810
08
0
–25
MinMaxMinMaxMinMax
25
Unitnsnsns
25nsns
1012
nsnsns
10nsns
tpUPD
202020202025ns
Note:
1. Transition is measured ± 200 mV from steady state voltage with Output Load B.
READ CYCLE NO. 1 (OE CONTROLLED)(2, 3)
Document # SRAM118 REV CPage 4 of 12
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P4C174
READ CYCLE NO. 2 (ADDRESS CONTROLLED)(2)
READ CYCLE NO. 3 (CE CONTROLLED)(2, 3)
Notes:
1. Transition is measured ±200 mV from steady state voltage withOutput Load B. This parameter is sampled, not 100% tested.2. CE is LOW, OE is LOW, WE is HIGH for READ cycle. CE or WE must be HIGH during address transitions.
3. All address lines are valid no later than the transition of CE to LOW.4. READ cycle time is measured from the last valid address to the first transitioning address.
5. Powerup occurs as a result of any of the following conditions: a) Falling edge of CE.
b) Falling edge of WE (CE active).
c) Any address line transition (CE active).
d) Any Data line transition (CE and WE active).
This device automatically powers down after TPUPD has elapsed from any of the prior conditions. Power dissipation is therefore a function of cycle rate, not CE pulse width.
6. CE is LOW, WE is LOW for WRITE cycle. CE or WE must be HIGH during address transitions.
7. WRITE cycle time is measured from the last valid address to the first transitioning address.
8. OE is LOW for this WRITE cycle to show TWZ and TOW.
Document # SRAM118 REV CPage 5 of 12
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P4C174
AC CHARACTERISTICS - WRITE CYCLE
(VCC = 5V ± 10%, 0°C to +70°C)SymboltWCtCWtAStAWtAHtWPtDWtDHtOWtWZ
Parameter
Write Cycle Time
Chip Enable LOW to End ofWrite
Address Valid to Beginningof Write
Address Valid to End ofWrite
End of Write to AddressChange
Write Pulse WidthData Valid to End of WriteEnd of Write to Data ChangeWrite Enable HIGH to OutputLOW-Z (1)
Write Enable LOW to OutputHIGH-Z (1)
–8870707600
4
–101090909600
4
–121210010010600
4
–151512012012700
5
–2020150150151000
7
–2520150150151000
7
MinMaxMinMaxMinMaxMinMaxMinMaxMinMax
Unitnsnsnsnsnsnsnsnsnsns
WRITE CYCLE NO. 1 (WE CONTROLLED)(6)
WRITE CYCLE NO. 2 (CE CONTROLLED)(6)
Document # SRAM118 REV CPage 6 of 12
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P4C174
AC CHARACTERISTICS - MATCH CYCLE
(VCC = 5.0V ± 10%, 0°C to +70°C)SymboltMCtADMtADMHtCEMtCEMHItOEMHItWEMHItDAMtDAMHParameterMatch Cycle TimeAddress Valid to MATCHValidAddress Change to MATCHChangeChip Enable LOW toMATCH ValidChip Enable HIGH toMATCH HIGHOutput Enable LOW toMATCH HIGHWrite Enable LOW toMATCH HIGHData Valid to MATCH ValidData Change to MATCHChange0–888377777039010103881010100–101212310101212130–121515310101515150–15202031515202015–202525–25MinMaxMinMaxMinMaxMinMaxMinMaxMinMaxUnitnsnsnsnsnsnsnsnsnsMATCH TIMING
Document # SRAM118 REV CPage 7 of 12
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P4C174
AC CHARACTERISTICS - RESET CYCLE
(VCC = 5.0V ± 10%, 0°C to +70°C)SymboltRRCtRPtRPUtRPDtRMHItRIXtRIRtPUR
Parameter
Reset Cycle TimeReset Pulse WidthReset LOW to PowerupReset LOW to PowerdownReset LOW to MATCH HIGHReset LOW to InputsIgnored
Reset LOW to inputsRecognized
Powerup to RESET LOW
00
358
10
–83580
358
00
40
12
–1040100
4010
00
45
15
–1245120
4510
00
50
20
–1550120
5012
00
50
25
–2050150
5015
00
60–2560150
6020
MinMaxMinMaxMinMaxMinMaxMinMaxMinMax
Unitnsnsnsnsnsnsnsns
RESET TIMING
AC TEST CONDITIONS
Input Pulse LevelsInput Rise and Fall TimesInput Timing Reference LevelOutput Load
GND to 3.0V< 3ns1.5V
Outputs Loads A, B & C
TRUTH TABLE
ModeStandbyReadWrite
CEHLL
WEXHL
OutputHigh ZDOUTHigh Z
PowerStandbyActiveActive
Output Timing Reference Level1.5V
Document # SRAM118 REV CPage 8 of 12
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P4C174
OUTPUT LOAD AOUTPUT LOAD BOUTPUT LOAD C
ORDERING INFORMATION
SELECTION GUIDE
The P4C174 is available in the following temperature, speed and package options.
Temperature RangeCommercialMiliitary TemperatureMilitary Processed*Package8Plastic DIPPlastic SOJSide Brazed DIPSide Brazed DIP-8PC-8JCN/AN/ASpeed10-10PC-10JCN/AN/A12-15PC-15JCN/AN/A15-15PC-15JC-15CM-15CMB20-20PC-20JC-20CM-20CMB25-25PC-25JC-25CM-25CMB* Military temperature range with MIL-STD-883, Class B processing.N/A = Not Available
Document # SRAM118 REV CPage 9 of 12
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P4C174Pkg ## PinsSymbolAbb2CDEeAeLQS1S2C528 (300 mil)MinMax-0.2250.0140.0260.0450.0650.0080.018-1.4850.2400.3100.300 BSC0.100 BSC0.1250.2000.0150.0700.005-0.005-SIDE BRAZED DUAL IN-LINE PACKAGEPkg ## PinsSymbolAA1bCDeEE1E2QJ528 (300 mil)MinMax0.1200.1480.078-0.0140.0200.0070.0110.7000.7300.050 BSC0.335 BSC0.2920.3000.267 BSC0.025-SOJ SMALL OUTLINE IC PACKAGE
Document # SRAM118 REV CPage 10 of 12
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Pkg #P5# Pins28 (300 mil)SymbolMinMaxA-0.210A1-b0.0140.023b20.0450.070C0.0080.014D1.3451.400E10.2700.300E0.3000.380e0.100 BSCeB-0.430L0.1150.150α0°15°Document # SRAM118 REV CPLASTIC DUAL IN-LINE PACKAGE
P4C174
Page 11 of 12
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P4C174
REVISIONS
DOCUMENT NUMBER:DOCUMENT TITLE:REV.ORABC
ISSUEDATE1997Oct-05Nov-05Aug-06
SRAM118
P4C174 HIGH SPEED 8Kx8 CACHE TAG STATIC RAM
ORIG. OFCHANGEDABJDBJDBJDB
DESCRIPTION OF CHANGENew Data SheetChange logo to Pyramid
Corrected error in Selection GuideUpdated SOJ package information
Document # SRAM118 REV CPage 12 of 12
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