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专利名称：Multichip packaged semiconductor device
and method for manufacturing the same
发明人：Sawaya, Hiromichi, c/oInt.Pro.Div., K.K.
Toshiba
申请号：EP92102066.5申请日：19920207公开号：EP0498446B1公开日：19970122
摘要：A plurality of semiconductor chips are mounted on a plurality of islands formedon a lead frame. Inner lead portions of the lead frame and electrode pads formed on thesemiconductor chips are electrically connected to one another via first lead portionsformed on a flexible resin tape and the electrode pads formed on the semiconductorchips are connected to one another via second lead portions formed on the flexible resintape. The flexible resin tape on which the islands and inner lead portions of the leadframe, the plurality of semiconductor chips and the first and second lead portions areformed is sealed into a resin package.
申请人：TOSHIBA KK
地址：JP
国籍：JP
代理机构：Lehn, Werner, Dipl.-Ing.
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