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专利名称：Semiconductor multi-chip package发明人：Young-Hee Song,Il-Heung Choi,Jeong-Jin
Kim,Hae-Jeong Sohn,Chung-Woo Lee
申请号：US10651813申请日：20030828公开号：US07148578B2公开日：20061212
专利附图：
摘要：A semiconductor chip comprises a semiconductor substrate having integratedcircuits formed on a cell region and a peripheral circuit region adjacent to each other. Abond pad-wiring pattern is formed on the semiconductor substrate. A pad-
rearrangement pattern is electrically connected to the bond pad-wiring pattern. Thepad-rearrangement pattern includes a bond pad disposed over at least a part of the cellregion. The bond pad-wiring pattern is formed substantially in a center region of thesemiconductor substrate. Thus, with the embodiments of the present invention, theoverall chip size can thereby be substantially reduced and an MCP can be fabricatedwithout the problems mentioned above.
申请人：Young-Hee Song,Il-Heung Choi,Jeong-Jin Kim,Hae-Jeong Sohn,Chung-WooLee
地址：Kyunggi-do KR,Kyunggi-Do KR,Chungcheongnam-Do KR,Kyunggi-DoKR,Kyunggi-Do KR
国籍：KR,KR,KR,KR,KR
代理机构：Marger Johnson & McCollom, P.C.
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