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专利名称：Composition of thermal interface material发明人：Kuo-Chan Chiou,Tzong-Ming Lee申请号：US11415610申请日：20060501
公开号：US20070161729A1公开日：20070712
摘要：A composition for a thermal interface material is provided. The deficiencies oflow thermal conductivity and high thermal resistance in the conventional thermalinterface materials are resolved. The CNT-LC thermal composite structure is formed byusing carbon nanotube with high thermal conductivity and liquid crystal polymer with thewell-ordered structure. The thermal interface material thereby has a high thermalconductivity. The added amount of carbon nanotube is less than the added amount ofmetal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible withoutphase separation. The thermal interface material has a phase change temperature about45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normaloperating temperature of device to reduce the thermal resistance of the entire device.
申请人：Kuo-Chan Chiou,Tzong-Ming Lee
地址：Tainan City TW,Hsinchu City TW
国籍：TW,TW
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