专利内容由知识产权出版社提供
专利名称：Thermal interface material composition
including polymeric matrix and carbon filler
发明人：Hitesh Arora,James C. Matayabas, Jr.申请号：US13625612申请日：20120924公开号：US020919B2公开日：20141230
摘要：Certain embodiments relate to compositions that may be used as thermalinterface materials in electronic assemblies. One such composition includes a blockcopolymer matrix comprising polystyrene and polybutene. The composition also includesa filler positioned in the copolymer matrix, the filler comprising carbon. The filler may incertain embodiments be a material selected from the group consisting of graphite,graphene, and carbon nanotubes. composition may include routing structures and theirformation. Assemblies may include the composition positioned between a die and a heatspreader. Other embodiments are described and claimed.
申请人：Hitesh Arora,James C. Matayabas, Jr.
地址：Chandler AZ US,Chandler AZ US
国籍：US,US
代理机构：Konrad Raynes Davda & Victor LLP
代理人：Alan S. Raynes
更多信息请下载全文后查看
