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专利名称：THERMAL INTERFACE MATERIAL
COMPOSITION INCLUDING POLYMERICMATRIX AND CARBON FILLER
发明人：Hitesh ARORA,James C. MATAYABAS, Jr.申请号：US13625612申请日：20120924
公开号：US20140087200A1公开日：20140327
摘要：Certain embodiments relate to compositions that may be used as thermalinterface materials in electronic assemblies. One such composition includes a blockcopolymer matrix comprising polystyrene and polybutene. The composition also includesa filler positioned in the copolymer matrix, the filler comprising carbon. The filler may incertain embodiments be a material selected from the group consisting of graphite,graphene, and carbon nanotubes. composition may include routing structures and theirformation. Assemblies may include the composition positioned between a die and a heatspreader. Other embodiments are described and claimed.
申请人：Hitesh ARORA,James C. MATAYABAS, Jr.
地址：Chandler AZ US,Chandler AZ US
国籍：US,US
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