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专利名称：Method for soldering integrated circuits发明人：Choul-su Kim,Woo-sik Kim,Byung-woo
Woo,Masaharu Tsukue
申请号：US09/127630申请日：19980803公开号：US06095405A公开日：20000801
摘要：Any one of at least two holding blocks loaded in a holding block storingportion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam isapplied to the whole surface of the PCB. The holding block is moved from the PCB to theholding block storing portion and cooled. It is then determined whether any other PCBto be soldered exists in the PCB array. If it is determined that any other PCB to besoldered exists in the PCB array, another holding block is picked up from the holdingblock storing portion and moved to cover an IC on the PCB of the PCB array. The abovesteps are repeated until all the PCBs of the PCB array to be soldered are completelysoldered. If it is determined that any other PCB to be soldered does not exist in the PCBarray, the PCB array is transferred to a subsequent process.
申请人：SAMSUNG ELECTRONICS CO., LTD.
代理人：Robert E. Bushnell, Esq.
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