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专利名称：Heat-resistant resin compositions发明人：Shuichi Suzuki,Moriyasu Wada申请号：US05/837203申请日：19770927公开号：US04131632A公开日：19781226
摘要：Resin compositions comprising maleimide compounds obtained by reactingmaleic anhydride with mixed polyamines produced by reaction between aniline andformaldehyde; diallylbisphenol compounds; and epoxy resins. The compositions displayprominent heat resistance when hardened.
申请人：TOKYO SHIBAURA ELECTRIC CO., LTD.
代理机构：Oblon, Fisher, Spivak, McClelland & Maier
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