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专利名称：Contact forming material for a vacuum
interrupter
发明人：Okutomi, Tsutomu,Yamamoto, Atsushi,Chiba,
Seishi,Seki, Tsuneyo,Okawa, Mikio,Honma,Mitsutaka,Otobe, Kiyofumi,Satoh,Yoshinari,Sekiguchi, Tadaaki
申请号：EP113804.2申请日：190726公开号：EP0354997B1公开日：19940427
摘要：An Ag-Cu-WC contact forming material for a vacuum interrupter comprising ahighly conductive component comprising Ag and Cu and an arc-proof componentcomprising WC wherein the content of the highly conductive component is such that thetotal amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage ofAg based on the total amount of Ag and Cu(Ag/(Ag + Cu)] is from 40% to 80% by weight;wherein the content of the arc-proof component is from 35% to 75% by weight; whereinthe structure of the contact forming material comprises a matrix and a discontinuousphase of the highly conductive component, the discontinuous phase having a thickness orwidth of no more than 5 micrometers, and a discontinuous grain of the arc-proofcomponent having a grain size of no more than 1 micrometer; and wherein thediscontinuous phase of the highly conductive component is finely and uniformlydispersed in the matrix at intervals of no more than 5 micrometers.
申请人：TOSHIBA KK
地址：JP
国籍：JP
代理机构：Liesegang, Roland, Dr.-Ing.
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