专利内容由知识产权出版社提供
专利名称：Automatic Polishing System
发明人：Hideo Shiwa,Genji Nakayama,Yoshio Higashi申请号：US197095申请日：20190204
公开号：US20210308826A1公开日：20211007
专利附图：
摘要：In an automatic polishing system configured such that under control of apolishing robot and/or a polishing tool by a polishing controller, the polishing toolprovides a polishing action on a polishing subject face, a color intensity measurementinstrument is provided for measuring an intensity of a specified color in the polishing
subject face. Based on the intensity of the specified color measured by this color intensitymeasurement instrument, the polishing controller controls the polishing robot and/orthe polishing tool, so that an amount of polishing work by the polishing tool onto thepolishing subject face is adjusted according to the intensity of the specified color.
申请人：Taikisha Ltd.
地址：Tokyo JP
国籍：JP
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