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专利名称：Wafer alignment and bonding发明人：Andrew H. Loomis申请号：US11973981申请日：20070926公开号：US07682933B1公开日：20100323
专利附图：
摘要：Provided is a method and apparatus for close alignment of two or moreelectrically conductive wafers which are positioned face-to-face in closely spacedopposition, the wafers having position marks on corresponding portions thereof, thewafers being aligned as to their mating components, as guided by optically comparing
the alignment of the respective position marks; deflecting an interior portion of one ofthe wafers into contact with the other wafer, to partially bond the wafers to each other,then fully contacting and bonding the rest of the wafer pair and then optically checkingthe resulting wafer alignment to see if same is acceptable.
申请人：Andrew H. Loomis
地址：Westford MA US
国籍：US
代理机构：AFMCLO/JAZ
代理人：Thomas C. Stover
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