专利内容由知识产权出版社提供
专利名称：Microelectromechanical systems
microphone packaging systems
发明人：Howard Allen,Luke England,Douglas Alan
Hawks,Yong Liu,Stephen Martin
申请号：US12947543申请日：20101116公开号：US08421168B2公开日：20130416
专利附图：
摘要：This document discusses, among other things, a conductive frame, a silicon diecoupled to the conductive frame, the silicon die including a vibratory diaphragm, the die
having a silicon die top opposite a silicon die bottom, with a silicon die port extendingthrough the silicon die to the vibratory diaphragm, with a silicon die terminal in electricalcommunication with the conductive frame and an insulator affixed to the conductiveframe and the silicon die, with the insulator extending through interstices in the
conductive frame to a conductive frame bottom of the conductive frame, and around anexterior of the silicon die to the silicon die top, with the insulator physically affixed to thesilicon die and to the conductive frame, with the silicon die port exposed and with aconductive frame terminal disposed at the conductive frame bottom in electricalcommunication with the silicon die terminal.
申请人：Howard Allen,Luke England,Douglas Alan Hawks,Yong Liu,Stephen Martin
地址：Limington ME US,Boise ID US,Escondido CA US,Scarborough ME US,SouthPortland ME US
国籍：US,US,US,US,US
代理机构：Schwegman, Lundberg & Woessner, P.A.
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