专利内容由知识产权出版社提供
专利名称：Box design for maximum heat dissipation发明人：Alexander Tzinares,Robert J.
McCarthy,Steven L. Wall
申请号：US09478573申请日：20000106公开号：US06201700B1公开日：20010313
专利附图：
摘要：A system and method for dissipating thermal energy created by multipleelectronic circuit boards packaged within a single housing and while in operation aredisclosed. The system and method enhances heat convection and heat conduction across
and through the housing. A heat conductive housing having a plurality of longitudinallyextending fins for increasing the surface area of the housing and correspondingly
increasing heat convection to the housing is utilized. Furthermore, the multiple electroniccircuit boards are packaged such that a heat conductive path, defined by a thermallyconductive material, is disposed between the plurality of electronic circuit boards. Finally,the heat conductive material is applied to the inner surface of the housing and betweeneach of the electronic circuit boards. The present invention increases heat conduction ofthe thermal energy generated by the plurality of electronic circuit boards to the housing,thereby preventing circuit board damage.
申请人：FORD MOTOR COMPANY
代理人：Jennifer M. Stec
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