专利内容由知识产权出版社提供
专利名称：Microelectromechanical microphone
packaging system
发明人：Wei-Chung Wang,Sung-Mao Wu,Hsueh-An
Yang,Kuo-Pin Yang,Chian-Chi Lin
申请号：US115598申请日：20061227
公开号：US20070205499A1公开日：20070906
专利附图：
摘要：The invention relates to a microelectromechanical microphone packagingsystem. The microelectromechanical microphone packaging system comprises a
substrate, a chip, a microelectromechanical microphone, a conductive glue, a non-conductive glue and a cover. The substrate has a first surface. The chip is mounted on thefirst surface of the substrate. The microelectromechanical microphone is mounted on thefirst surface of the substrate, and electrically connected to the chip. The chip is enclosedby the non-conductive glue. The non-conductive glue is enclosed by the conductive glue.The cover is mounted on the first surface of the substrate to form a containing space,and has an acoustic aperture. The microelectromechanical microphone packaging systemutilizes the conductive glue enclosing the chip and the non-conductive glue to shieldinterference from outside noise and obtain a shielding effect. In addition, the cover doesnot need to be made of metal material.
申请人：Wei-Chung Wang,Sung-Mao Wu,Hsueh-An Yang,Kuo-Pin Yang,Chian-Chi Lin
地址：Kaohsiung TW,Kaohsiung TW,Kaohsiung TW,Kaohsiung TW,Kaohsiung TW
国籍：TW,TW,TW,TW,TW
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