专利内容由知识产权出版社提供
专利名称：SCRIBE BASED BOND PADS FOR
INTEGRATED CIRCUITS
发明人：Andrew Burnside,Albert Dye,Hugh Dick申请号：US12506136申请日：20090720
公开号：US20090278124A1公开日：20091112
专利附图：
摘要：An apparatus including a semiconductor substrate is disclosed. A firstsemiconductor die is disposed on the semiconductor substrate. A first bond out pad isdisposed on the semiconductor substrate adjacent to the first semiconductor die. A first
sawn semiconductor die is disposed on the semiconductor substrate adjacent to the firstsemiconductor die and the first bond out pad.
申请人：Andrew Burnside,Albert Dye,Hugh Dick
地址：Glasgow GB,Coatbridge GB,Shawlands GB
国籍：GB,GB,GB
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