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专利名称：Electronic component accommodation
structure
发明人：石橋 誠司,蔵本 祐司,渡邉 俊夫申请号：JP2018030339申请日：20180223公开号：JP20191431A公开日：20190829
专利附图：
摘要：Problem to be solved: to provide a water proof structure for preventing theelectronic components from being exposed in an electronic component containingstructure having a coolant flow passage through which cooling water is inserted. Thepower converter 100 isA cooling base 22 is provided on the upper side of the recesswhich serves as the refrigerant flow pathThe cooler plate 23 is provided in the recess.Acooler 20 having a refrigerant flow path 24 sealed by a flow path seal 26 provided in anouter peripheral portion of the cooling plate 23The upper enclosure 30 covered with the
top surface of the coolerA lower enclosure 40 covered with the bottom surface of thecoolerIn the internal space 30a of the upper housingA power module 53 mounted on thetop surface of the cooler plateBetween the channel seal 26The structure is provided witha water proof preventing wall provided so as to protrude from the upper surface of thecooler plate 23 to surround the power module 53.A terminal table 52 serving as a waterproof wall includes a seal member 81 and a wall surface 52A disposed thereon.Diagram
申请人：三菱電機株式会社
地址：東京都千代田区丸の内二丁目７番３号
国籍：JP
代理人：大岩 増雄,竹中 岑生,村上 啓吾,吉澤 憲治
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