HI-SINCERITYMICROELECTRONICS CORP.Spec. No. : HE6616-BIssued Date : 1993.09.24Revised Date : 2000.12.01Page No. : 1/4H2N6718VNPN EPITAXIAL PLANAR TRANSISTORDescriptionThe H2N6718V is designed for general purpose medium poweramplifier and switching.Absolute Maximum Ratings• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °CJunction Temperature................................................................................... +150 °C Maximum• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................... 1.6 W• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... 100 VBVCEO Collector to Emitter Voltage................................................................................. 100 VBVEBO Emitter to Base Voltage........................................................................................... 5 VIC Collector Current.............................................................................................................. 1 A
Electrical Characteristics (Ta=25°C)
SymbolBVCBOBVCEOBVEBOICBO*VCE(sat)*hFE1*hFE2*hFE3fTCob
Min.1001005--80502050-Typ.----------Max.---100350-250--20
UnitVVVnAmV
Test Conditions
IC=100uA, IE=0IC=1mA, IB=0IE=10uA, IC=0VCB=80V, IE=0
IC=350mA, IB=35mAIC=50mA, VCE=1VIC=250mA, VCE=1VIC=500mA, VCE=1V
VCE=10V, IC=50mA, f=100MHzVCB=10V, f=1MHz, IE=0
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
MHzpF
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
1000Spec. No. : HE6616-BIssued Date : 1993.09.24Revised Date : 2000.12.01Page No. : 2/4
Current Gain & Collector Current1000Saturation Voltage & Collector Current100Saturation Voltage (mV)VCE=1VhFE100VCE(sat) @ IC=10IB100.11101001000100.11101001000Collector Current (mA)Collector Current (mA)Capacitance & Reverse-Biased Voltage1001000Cutoff Frequency & Collector CurrentCutoff Frequency (MHz)Capacitance (pF)VCE=10V10Cob10010.11101001000101101001000Reverse Biased Voltage (V)Collector Current (mA)Safe Operating Area1000018001600140012001000800600400200Power Derating100PT=1 msPT=100 ms10PT=1 sPower Dissipation-PD(mW)Collector Current-IC (mA)1000111010010000020406080100o120140160Forward Voltage-VCE (V)Ambient Temperature-Ta(C)HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616-BIssued Date : 1993.09.24Revised Date : 2000.12.01Page No. : 3/4
IR Reflow Profile26024022020018016014012010080604020005010015020025030000150+/-305040+/-20 sec10+/-2 sec300Temperature Profile for Dip Soldering10+/-2 sec250Temperature(C)Temperature(C)200oo150100120+/-20 sec50100150200250300350Time(sec)Time(sec)HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
Marking :Spec. No. : HE6616-BIssued Date : 1993.09.24Revised Date : 2000.12.01Page No. : 4/4
ADEF32N1MLGJKOHCBHSMC LogoPart NumberDate CodeProduct SeriesRankInk MarkingIStyle : Pin 1.Emitter 2.Collector 3.Base3-Lead TO-126ML Plastic PackageHSMC Package Code : D*:Typical
DIMABCDEFGH
InchesMin.Max.0.13560.14570.01700.02720.03440.04440.05010.06010.11310.12310.07370.08370.02940.04940.04620.0562Millimeters
Min.Max.3.443.700.430.690.871.121.271.522.873.121.872.120.741.251.171.42
DIMI
JKLMNO
InchesMin.Max.-*0.1795
0.02680.03310.55120.59060.29030.30030.13780.14780.15250.16250.07400.0842Millimeters
Min.Max.-*4.56
0.680.8414.0015.007.377.623.503.753.874.121.882.14
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.CTel : 886-3-5983621~5 Fax : 886-3-5982931
• Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.CTel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
