工作中常用中英文

工作中常用中英文

一、一般英语：

1. 采购- purchase 2. 材料- material 3. 评估- evaluation 4. 供应商- supplier / vendor 5. 总经理- general manager ( GM ) 6. 进料incoming 7. 质量quality 8. 控制- control 9. 装箱单- packing list 10. 数量- quantity 11. 型号- model 12. 描述- description 13. 制表/发布- issue 14. 表格- form 15. 文件- document 16. 制造商- manufacturer 17. 接收- accept (Acc.) 18. 拒收- reject (Rej.) 19. 项目- item 20. 个- piece（Pc.） 21. 放宽- waive 22. 缺陷- defect 23. 合格- pass

24. 不合格- not good ( NG ) 25. 日期- date

26. 生产线- production line / line 27. 备注- remark 28. 仓库- store 29. 产品- product

30. 静电敏感元件- static sensitive device (SSD) 31. 静电释放- electricity static discharge (ESD) 32. 进- in

33. 出- out 34. 结余- balance 35. 备注- remark 36. 参数- reference 37. 单位- UM 38. 标签- label 39. 打印- print 40. 计划- plan 41. 图表- chart 42. 质量- quality 43. 传真- fax

44. 新加坡- Singapore 45. 检查- check 46. 箱子- case / carton 47. 盒子- box

48. 系列号- serial number ( S/N ） 49. 部门- department (Dept.) 50. 客户- customer 51. 通知- notice 52. 清单- bill 53. 平均- average

54. 文控中心- document control center ( DCC ) 55. 计划员- planner 56. 流程图- flow chart 57. 工艺- instruction 58. 校准- calibration 59. 校验- verify 60. 设备- equipment 61. 培训- training 62. 不良品- failed product 63. 预计- forecast . 安全- safety

65. 程序- program / procedure 66. 图纸- drawing 67. 过程- process

68. 隔离- separate / insulate 69. 返工- rework 70. 合同- contract

71. 准时- just in time ( JIT ) 72. 准时交付- delivery on time 73. 运输- shipment / transportation 74. 方式- method 75. 费用- cost 76. 报废- scrap

二、专业英语：

物资部——常用中英文缩略语：

1. CO: Customer Order 客户订单2. MO: Manufacture Order 生产订单 3. PO: Purchase Order 采购订单4. DO: Delivery Order 发货单 5. FCST: Forecast Order 预测订单

6. MRPII: Manufacturing Resource Planning MRPII系统7. FS: Fourth Shift 四班系统 8. PMC: Planner Material control 计划员

9. MRB： Material Review Board 物料评审会议 10.RTV: Return To Vendor 退还供应商 11.ECN： Engineering Change Notice 工程更改通知 12.GRN: Goods Received Note 材料入库单

13.PWO： Production Work Order 配发单14.MRF ： Materials Requisition Form 材料申请单 15.AMRF： Non-Prod/Aux Materials Requisition Form辅助物料申请单 16.RTS ： Return To Store 回库单 17.SCRAP： Scrap Form 报废单

18.RCN: Result Changed Note 进检结果更改单

19.ITN: Inventory Transfer Note 移库单20.INV： Invoice 21.DN： Debit Note 借方凭单

22.CN： Credit Note 贷方凭单23.PCBA: Printed Circle Board Assembly 印刷线路板组装，

24.IQC： Incoming Quality Control 进料品质控制 25.IPQC: In Process Quality Control 在线品质检查 26.SMT： Surface Mounting Technology 表面贴装技术 27.AI： Automatic Insertion 自动插装 28.WIP: Work In Process 在制品 29.PCB: Printed Circle Board 印刷电路板

30.PCBA: Printed Circle Board Assembly 印刷电路板组装 31.P/A: PCB Assembly 电子产品装配 32.ICT： Internal Circle Test 内部线路测试 33.FCT： Function Test 功能测试 34.BOM: Bill of Material 材料清单

35.AVL: Approved Vendor List 合格供应商清单

36.DOC: Declaration of Conformity 符合性声明，由供方向客户或相关方提供。 37.SOC： Statement of Conformity 符合性公告，由供方向公众提供。 38.VCAR： Vendor Corrective Action Report 供应商改善措施报告 39.QA: Quality Assurance 品质保证 40.ESD: Electrostatic Discharge 静电放电

41.4M1E： Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境 42.FMEA: Failure Mode Effect Analysis 失效模式与后果分析 43.CP: Control Plan 控制计划

44.ISO: International Standardization Organization 国际标准化组织

45.EDX-720: Energy Dispersive X- Ray Spectrometer， 能量色散型X荧光光谱仪。 品质部——常用中英文缩略语

1.4M1E：Man/ Machine/Material/Method/ Environment 人/机器/原材料/作业方法/环境 2.AI: Automatic Insertion 自动插装

3.AQL: Accepted Quality Level 品质充收水准 4.AOI: Auto Optics Inspection 自动光学检测 5.AOQ：Average Outgoing Quality 平均出货水平

6.APQP：Advanced Product Quality Planning产品先期策划 7.AVL: Approved Vendor List 合格供应商清单 8.BOM: Bill of Material 材料清单

9.BS: Bottom Side 下表面（通常指PCBA的焊点面） 10.CP: Control Plan 控制计划

11.COC: Certificate of Conformance 一致性声明 12.CAR: Corrective Action Report 改善措施报告 13.CPK: Capability Process Index 制程能力指数 14.CTQ: Critical to Quality 关键质量特性

15.DMAIC：Define-Measure-Analyse-Improve-Control 定义-测量-分析-改善-控制（6Sigma分析的5个步骤）

16.DOC: Declaration of Conformity 符合性声明

17.DPMO: Defect Per Million Opportunity 百万缺陷机会数

18.DOE: Design of Experiment 实验设计

19.ECN: Engineering Change Notice 工程更攺通知 20.EMC: Electro Magnetic Compatibility 电磁兼容 21.ESD: Electrostatic Discharge 静电放电

22.FMEA: Failure Mode Effect Analysis 失效模式与后果分析 23.F/A: Final （Product） Assembly 最终装配（总装） 24.FQC: Final Quality Check 最终品质检查 25.FCT: Function Test 功能测试

26.FAAR: First Article Approved Report 首件检验报告 27.FIFO：First In First Out 先入先出

28.ISO: International Standardization Organization 国际标准化组织 29.IQC: Incoming Quality Check 进料品质检查 30.IPQC: In Process Quality Control 在线品质检查 31.ICT: Internal Circle Test 内部线路测试 32.LSL: Lower Specification Limit 规格下限 33.LCL: Lower Control Limit 控制下限 34.MRB: Material Review Board 物料评审会议 35.MSA: Measure System Analysis 测量系统分析 36.MSDS：Material Safety Data Sheet原材料安全资料 37.MTBF: Mean Time Between Failures 平均无故障时间 38.ODM: Original Design & Manufacture 委托设计与制造 39.OEM: Original Equipment Manufacture 委托代工 40.OQA: Outgoing Quality Assurance 出货品质保证 41.ORT: Outgoing Reliability Test 出货产品可靠性测试 42.P/A: PCB Assembly 电子产品装配

43.PDCA: Plan-Do-Check-Action 计划-做-检查-规范（一种管理模式） 44.PCB: Printed Circle Board 印刷电路板

45.PCBA: Printed Circle Board Assembly 印刷电路板组装 46.PPAP：Production Part Approval Process 生产件批准程序 47.QA: Quality Assurance 品质保证 48.QCC: Quality Control Circle 品管圈 49.QE: Quality Engineering 品质工程

50.QFD: Quality Function Deployment 质量功能展开 51.QMS：Quality Management System 品质管理体系

52.R&R: Repeatability & Reproducibility （测量系统中）重复性和再现性

53.SCAR: Supplier Corrective Action Report 供应商改善措施报告 54.SMT: Surface Mounting Technology 表面贴装技术 55.SQE: Supplier Quality Engineering 供应商品质工程 56.SOC: Statement of Conformity 符合性公告 57.SPC: Statistical Process Control 统计过程控制 58.TQM: Total Quality Management 全面质量管理 59.TPM: Total Production Management 全面生产管理 60.TS: Top Side 上表面（通常指PCBA的元件面） 61.USL: Upper Specification Limit 规格上限 62.UCL: Upper Control Limit 控制上限

63.VCAR: Vendor Corrective Action Report 供应商改善措施报告 .WIP: Work In Process 在制品 65.WI: Working Instruction 操作指引

SMT——常用中英文缩略语

1.表面贴装技术- surface mounting technology ( SMT ) 2.品质计划- quality plan ( QP )

3.制造工程师- manufacturing engineer ( ME ) 4.文控中心- document control center ( DCC ) 5.组织结构图- organization chart 6.流程图- flow chart

7.产品品质先期策划- advanced product quality planning ( APQP )

8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA) 9.控制计划- control plan ( CP ) 10.工艺- instruction

11.出货检查标准- outgoing quality inspection instruction 12.工程更改通知- engineering change notice (ECN) 13.锡膏- solder paste 14.红胶- glue

15.印锡- paste printing

16.在线测试- in circle test ( ICT ) 17.设备- equipment 18.培训- training 19.不良品- failed product 20.预计- forecast

21.生产订单- manufacturing order ( MO ) 22.印锡机- printing machine 23.贴片机- mounter 24.烘炉- oven

25.自动插机- automatic insert ( AI ) 26.制程中- work in process ( WIP ) 27.百万分之- PPM28.钢网：stencil

29.表面贴装设备：surface mount device (SMD) 30.飞达：feeder

31.印刷线路板: print circuit board （PCB） 32.BS面：bottom side (BS) 33.TS面: top side (TS)

34.自动插件：automatic insertion (AI) 35.单列直插：single line package (SIP) 36.双列直插：dual line package (DIP)

37.小型封装晶体管：small outlet transistor (SOT) 38.电阻：resistor (R) 39.电容：capacitor （C） 40.二极管: diode (D) 41.三极管: transistor (T) 42.电感: inductor (L) 43.晶振: crystal 44.连接器: connector 45.开关: switch

46. 球形触点阵列: ball grid array (BGA) 47.四侧引脚扁平封装: quad flat package (QFP) 48.板上芯片封装: chip on board (COB)

生产部——常用中英文缩略语 PCB组装

1. 插机- insert / insertion 2.外观检查- visual inspection 3. 波峰焊接- wave soldering 4. 过波峰模板- panel 5. 分板- depanning

6. 补焊- touch up 7. 清洗- clearing

8.点胶- gluing9.功能测试- function test 10.自动测试仪- automatic test machine ( ATM ) 11.高压测试- hi-pot test 12.绝缘测试- insulation test 13.老化- burn-in 14.包装- packing

15.客户样品- golden sample / customer sample 16.试生产- trial run

17.临时样品- temporary sample 18.功能测试- function test 19.终检- final inspection 20.试产报告- trial run report

21.首件报告- first article approval report ( FAAR ) 22.在线品质控制- in process quality control ( IPQC ） 23.可疑材料- suspect material 24.纠正措施- corrective action 25.预防措施- preventive action

26.改善措施报告- corrective action report ( CAR ) 总装

27.总装- final assembly

28.超音波焊接机- supersonic welding machine 29.基准- benchmark

30.测量系统分析- measurement system analysis ( MSA )

31.量具重复性和再现性- gauge repeatability & reproducibility ( GR&R 32.灌胶：fill glue 其它

33.待检区： check-waiting zone 34.周转箱：box turnover 35.电阻：resistor (R) 36.电容：capacitor （C） 37.二极管: diode (D) 38.三极管: transistor (T) 39.电感: inductor (L)

40.晶振: crystal 41.连接器: connector 42.开关: switch

43.成品区：finished product zone 44.项目组：item brigade 45.工具：Tool facility 46.工艺- instruction 47.设备- equipment 48.不良品- failed product

49.生产订单- manufacturing order ( MO ) 50.不良品- failed product 51.锡炉：stannum furnace 52.报表：report forms 53.宣传栏：announce cote

ME部——常用中英文缩略语 1.品质计划- quality plan ( QP )

2.制造工程师- manufacturing engineer ( ME ) 3.项目工程师- project engineer (PE) 4.文控中心- document control center ( DCC ) 5.组织结构图- organization chart 6.流程图- flow chart

7.产品品质先期策划- advanced product quality planning ( APQP )

8.潜在失效模式及影响分析- potential failure model and effect analysis ( PFMEA) 9.控制计划- control plan ( CP )

10.线路板总装-print circuit board assembly (PCBA) 11.工艺- work instruction

12.出货检查标准- outgoing quality inspection instruction 12.工程更改通知- engineering change notice (ECN)

13.临时工程更改通知- temporarily engineering change notice(TECN) 14.设计更改通知- design engineering change notice(DECN) 15.温度曲线-profile 16.x-ray 17.BGA 返修台 18.锡膏- solder paste 16.红胶- glue

17.印锡- paste printing

18.在线测试- in circle test ( ICT ) 17.设备- equipment 18.培训- training 19.不良品- failed product 20.预计- forecast

21.生产订单- manufacturing order ( MO ) 22.印锡机- printing machine 23.贴片机- mounter 24.烘炉- oven

25.自动插机- automatic insert ( AI ) 26.制程中- work in process ( WIP ) 27.百万分之- PPM

产品技术部——常用中英文缩略语 1.charge 充电器 2.transformer 变压器 3.inductance 电感 4.leakage inductance 漏感

5.automatic test equipment 自动测试设备 6.wrong component 错件

7.resistor value deviation 阻值偏差

8.component short with heat sink 元件与散热器短路 9.leads no insert 管脚没插入 10.component damaged 元件破损 11.gold finger dirty 金手指脏

12.gold finger with solder 金手指上锡 13.short circuit 短路 14.open circuit 开路

15.copper pad peel off 跳铜皮 16.component inverse 元件反 17.test fixture 测试工装 19.miss component 漏件 20. void solder 虚焊

21.solder ball& solder residue 锡珠和锡渣

22.manufacture inverse 加工反 23.open circuit in primary 初级断线 24.secondary circuit short 次级短路 25.wire of transformer break 变压器线断 26.PWM Pulse Width Modulation 脉冲编码调制 27.SPI Serial periphery interface 串行外围接口 28.DAC Digital-to-Analog Converter 数模转换 29.BGA(ball grid array) 球形触点陈列 30.PCB Printed Circuit Board 印刷电路板 31.ICT:in circuit test 在线电路测试

32.AOI:automatism optics inspect 自动光学检测 33.FCT;function test 功能测试

34.MSA:measure system analyse 测量系统分析 35.ATE:automatism test equipment 自动测试设备 36.WM:Pulse Width Multiplier 脉冲宽度倍增器

37.LCR测试仪:inductance capacitance resistance 电感、电容、电阻测试仪 38.PED:product engineering department 产品技术部 39.ADC:Analog-to-Digital Converter 模数转换器

40.PEC:Precision Electronic Components 光电管、光电元件 41.MOS管：Metal-Oxide Semiconductor 金属氧化物半导体 42.IC:interchange 集成电路、指令计数器 43.UDS:=Universal Data System 通用数据系统 44.LED:light-emitting diode 发光二极管

45.IMEI:IMEI(INTERNATIONAL MOBILE EQUIPMENT IDENTIFIER).国际移动设备识别码 46.Mobile Phone 移动电话

47.GSM： Global System for Mobile Communication 全球移动通信系统 48.AFC(Automatic Frequency Control) 自动频率控制 49.AGC(Automatic Gain Control) 自动增益控制 50.AFT(Automatic Frequency Tune) 自动频率调谐 51.CNR(C/N )(Carrier to Noise Ration) 载噪比 52.ACI(Adjacent-Channel Interference) 邻频干扰 53.DPX(Diplexer) 双工器

54.FDMA(Frequency Division Multiple Access) 频分多址 55.CDMA Code Division Multiple Access

56.TDMA： Time Division Multiple Access 时分多址

57.TCH： Traffic Channel 业务信道

58.CCCH： Common Control Channel 公共控制信道 59.BCCH： Broadcast Control Channel 广播控制信道 60.SIM： Subscriber Identity Module 用户识别卡 61.SMS： Short Message Service 短消息业务

62.MMS: Multimedia Messaging Service中文译为多媒体信息服务，也称“彩信” 63.PIN： Personal Identification Number 个人识别号码 .PHS Personal Handy-phone System 小灵通 65.BT Board test 板测 66.DL Download 下载

67.PCM： Pulse Code Modulation 脉码调制 68.ANT(Antenna) 天线

69.GMSK： Gaussian Filtered Minimum Shift Frequency Keying 高斯滤波最小移频键控 70.BER： Bit Error Rate 比特误码率 71.打火： spark 72.单片机： MCU 73.模式： mode 74.C总线： C-BUS

HRD——常用中英文缩略语

人力资源管理:(Human Resource Management ,HRM) 人力资源经理:( human resource manager)

高级管理人员:(executive)职业:(profession)道德标准:(ethics) 操作工:(operative employees)专家:(specialist)

人力资源认证协会:(the Human Resource Certification Institute,HRCI) 外部环境:(external environment)内部环境:(internal environment)

:(policy)企业文化:(corporate culture)目标:(mission)股东:(shareholders) 非正式组织:(informal organization)公司:(multinational corporation, MNC) 管理多样性:(managing diversity)工作:(job) 职位:(posting)工作分析:(job analysis) 工作说明:(job description)工作规范:(job specification) 工作分析计划表:(job analysis schedule, JAS)

职位分析问卷调查法:(Management Position Description Questionnaire, MPDQ) 行政秘书:(executive secretary)地区服务经理助理:(assistant district service manager)

人力资源计划:(Human Resource Planning, HRP)

战略规划:(strategic planning)

长期趋势:(long term trend)要求预测:(requirement forecast)

供给预测:(availability forecast)管理人力储备:(management inventory)

裁减:(downsizing)人力资源信息系统:(Human Resource Information System, HRIS)

招聘:(recruitment)

员工申请表:(employee requisition)

招聘方法:(recruitment methods)内部提升:(Promotion From Within ,PFW) 工作公告:(job posting)广告:(advertising)职业介绍所:(employment agency) 特殊事件:(special events)实习:(internship)选择:(selection)选择率:(selection rate) 简历:(resume)标准化:(standardization)有效性:(validity)客观性:(objectivity) 规范:(norm)录用分数线:(cutoff score)准确度:(aiming)

业务知识测试:(job knowledge tests)求职面试:(employment interview) 非结构化面试:(unstructured interview)结构化面试:(structured interview)

小组面试:(group interview)职业兴趣测试:(vocational interest tests)会议型面试:(board interview)

组织变化与人力资源开发

人力资源开发:(Human Resource Development ,HRD)

培训:(training)开发:(development)定位:(orientation)训练:(coaching)辅导:(mentoring) 经营管理策略:(business games)案例研究:(case study)会议方法:(conference method) 角色扮演:(role playing)工作轮换:(job rotating) 在职培训:(on-the-job training ,OJT)媒介:(media)

企业文化与组织发展

企业文化:(corporate culture)组织发展:(organization development, OD)调查反馈:(survey feedback) 质量圈:(quality circles)目标管理:(management by objective, MBO)全面质量管理:(Total Quality Management, TQM) 团队建设:(team building)

职业计划与发展

职业:(career)职业计划:(career planning)职业道路:(career path)职业发展:(career development) 自我评价:(self-assessment)职业动机:(career anchors) 绩效评价

绩效评价:(Performance Appraisal ,PA)小组评价:(group appraisal)业绩评定表:(rating scales method) 关键事件法:(critical incident method)排列法:(ranking method)平行比较法:(paired comparison) 硬性分布法:(forced distribution method)晕圈错误:(halo error)宽松:(leniency)严格:(strictness) 反馈:(-degree feedback)叙述法:(essay method)集中趋势:(central tendency)

报酬与福利

报酬:(compensation)

直接经济报酬:(direct financial compensation) 间接经济报酬:(indirect financial compensation) 非经济报酬:(no financial compensation)

公平:(equity)

外部公平:(external equity)内部公平:(internal equity)员工公平:(employee equity)小组公平:(team equity) 工资水平领先者:(pay leaders)现行工资率:(going rate)工资水平居后者:(pay followers) 劳动力市场:(labor market)

工作评价:(job evaluation)

排列法:(ranking method)分类法:(classification method)因素比较法:(factor comparison method) 评分法:(point method)海氏指示图表个人能力分析法:(Hay Guide Chart-profile Method) 工作定价:(job pricing)工资等级:(pay grade)工资曲线:(wage curve)工资幅度:(pay range)

福利和其它报酬问题

福利(间接经济补偿)

员工股权计划:(employee stock ownership plan, ESOP)值班津贴:(shift differential) 奖金:(incentive compensation)分红制:(profit sharing)

安全与健康的工作环境

安全:(safety)健康:(health)频率:(frequency rate)紧张:(stress)角色冲突:(role conflict) 催眠法:(hypnosis)酗酒:(alcoholism)

员工和劳动关系

工会:(union)地方工会:(local union)行业工会:(craft union) 产业工会:(industrial union)全国工会:(national union)

谈判组:(bargaining union)劳资谈判:(collective bargaining)仲裁:(arbitration) 罢工:(strike)内部员工关系:(internal employee relations) 纪律:(discipline)纪律处分:(disciplinary action)申诉:(grievance) 降职:(demotion)调动:(transfer)晋升:(promotion)

设备部——常用中英文缩略语 与波峰焊接相关的：

波峰焊接机 wave soldering machine

低固态免清洗助焊剂Low-Solids No-Clean Liquid Flux 稀释剂 thinner 溶剂 solvent 无卤化物 halide-free 流量 flux 气压 air pressure 比重 specific gravity 固态含量 percent solids 发泡 foam 喷雾 spray 锡条 Tin bar 合金 alloy 熔点 melting point 密度 density 氧化物 oxide 残留物 residue 可焊性 solderability

预热温度 preheat temperature 焊接温度 soldering temperature 预热时间 preheating time

触波时间 dwell time 波峰形状 solder wave shape 斜率 slope

链速 conveyor speed 风刀 air knife

预热区 preheating zone 表面张力 surface tension

锡 Sn 银Ag铜Cu铅Pb锌Zn铁Fe砷As镍Ni铋Bi镉Cd铝Al铟In

与工装相关的： 工装 fixture 夹具 jig

模具 die/mould/mold 铣床 milling machine 车床 lathe

钻床 drilling machine 磨床grinding machine 弓锯机 hack sawing machine 线切割机床linear cutting machine

计算机数控CNC=Computer Numerical Control 精度 precision 硬度 hardness 表面处理 surface finish 电镀 plating 电木 bakelite 黄铜 brass 钢 steel

不锈钢stainless steel 铆钉 rivet 螺栓 bolt 螺钉 screw 螺母 nut 弹簧 spring

与PCB相关的英文

PCB ---printed circuit board 印制电路板 成品检验报告out-going inspection report 版本号revision 检查项目item 规格要求specification

V-cut V割（为便于分板而在板与板之间割一条槽） 孔壁铜厚hole copper thickness 电性测试E-test

外观检查appearance inspection 环保要求environmental request 开路open 短路short

可焊性solderability

3M胶带3M tape (3M是公司名称) 热冲击试验thermal shock test 孔径检测 hole size inspection 单位unit 数量quantity 最大Max 最小Min

检查员 inspected by 审核 checked by 板料 laminate

物料类型material type 颜色color

成品厚度finish thickness 介质厚度 dielectric thickness 底铜厚度base copper thickness 电镀层厚度plating thickness 金厚gold thickness 镍厚nickel thickness

线面铜厚circuits copper thickness 阻焊剂solder mask

单/双面single/both sides 胶带测试tape test 位置location

标识（标记）identification 公司标志company logo 外形尺寸outline dimension 目检visual inspection 板曲warp and twist 阻抗impedance test

离子污染测试ionic contamination tester 碳油电阻carbon resistance 可剥离胶 peelable mask

客户特别要求customer special requirement 实际值actual data 公差tolerance 评论comments 偏差deviation

阻焊厚度solder mask hardness

其他类型英文 封面 menu 页数 page number 变更记录change record 作业指导书work instruction 物料表BOM (bill of materials) 供应商列表AVL(approved vendor list) 流程图flow chart 装配assemble 橡胶（硅胶）rubber 按键key 拧紧tighten 包装packing

来料检验规范inspection standard for IQC 制造检验规范inspection standard for IPQC 成品检验规范 inspection standard for FQC

成品出货检验报告final inspection report 品质文件quality document 序列号serial No.（通常简写S/N） 产品名称product name 变更日期changed date 变更内容changed contents 备注remark 分析analysis

出报告（填写报告）issue report 图纸编号drawing No. 材料名称material name 物料描述material description 单位用量unit quantity 尼龙PA/nylon 不锈钢stainless steel 纸箱carton 卡板pallet PE袋 PE bag 弹簧spring 底座base 刀卡paper board 执行implement 目的purpose 指导guide

适用范围apply scope

产品工艺流程 production procedure 采购purchase 注塑（啤）injection 预装配subassembly 装配assembly 入库put in warehouse 出货shipping

依据（根据）according to 作业方法method 图示picture

授权人签名authorized signature 公司印签company stamp 联系号码contact number

授权人姓名name of authorized person 声明declaration 一致性conformity 螺丝刀screw drive 通用产品general parts 尖嘴钳 pliers 转矩力量torque 参考reference 方向position

客户编码customer P/N 生产周期 date code 批量 lot Qty 样本数 sample size 报告号 report No. 英寸 inch 毫米mm 厘米cm

中文名称 英文名称 中文名称 英文名称 管脚长 lead long 脱脚 lead pull off 弯脚角度大 lead bend angle big 弯脚角度小 lead bend angle small component insert 元件插反 inverse 元件插错 component insert wrong 元件漏插 missing component 元件损伤 component damaged 元件压铜皮 component press pad 按键不良 keystroke no click 屏蔽罩击穿 shield breakdown PCB不清洁 PCB dirty PCB变形 PCB deformation PCB来料不良 Incoming PCB NG PCB线路不良 Circuit NG on PCB PCB有裂/缺 PCB crack/flaw 批峰 burr 破损 dilapidation 偏移 shift 气泡 air bulb keystroke assemble 按键装反 inverse 表盖刮伤 surface cover scratch 包焊 excess solder 标签不良 label NG 标签刮伤 label scratch 标签漏 missing label 标签来料不良 incoming label NG 其它 others 日期印漏 missing date code stamp 日期印错 wrong date code stamp 日期印模糊 date code stamp vague 绕线交叉 wrap wire cross 绕组不均匀 wrap no even 绕组错 coil wrong 输出插头 标签模糊 label vague 松 output plug loose 手插管脚 标签填错 fill wronly in label 长 M/I lead long 手插管脚 标签贴错 label stick wrongly 短 M/I lead short 输出.输入 标签贴反 label stick inverse 线破损 output&input wire dameged 标签贴偏 label stick with offset 少插跳线 missing jumper wire 标签贴斜 label stick lean 输出线断 output wire open 输出线内 标签有气泡 label with air bulb 部错位 output wire wrong inside 输出线头 标签脏污 label dirty 断 output wire head breakdown 手插元件 有灰尘 dust 插错 M/I component wrong 手插元件 板响 board with noise 插反 M/I component inverse 手插元件 保险管夹松 fuse clip loose 多插 M/I component excessive wire of transformer 手插元件 变压器断线 breakdown 高 M/I component high 手插元件 插错 insert wrongly 漏插 miss M/I component 初,次级绕primary & secondary 手插元件反 coil wrap inverse 损伤 M/I component damage 贴反 mounting inverse 次级对磁蕊secondary short to 短路 magnet 初级短路 primary circuit short 次级短路 secondary circuit short 初级断线 open circuit in primary open circuit in 次级断线 secondary 少垫片 lack of gasket 上盖变形 upper case deformation 少件 lack of component 高件 component raise up 红胶溢出 red adhesive overflow 竖件 component stand up 初级胶带破 tape damage in primary 少锡 insufficient solder tape damage in 次级胶带破 secondary 元件氧化 component oxidize 初级圈数多 excessive primary wrap 元件虚焊 empty solder insufficient primary 初级圈数少 wrap 元件短路 component short circuit insufficient secondary 次级圈数少 wrap 元件贴反 component mount inverse excessive secondary 次级圈数多 wrap 元件翘起 component lift up the quantity of 次级绕错匝secondary circle is 数 wrong 元件损伤 component damage 插破侧盖 side cover break 元件偏移 component excursion 插破骨架 bobbin break 元件翻面 component turnover 超声波压伤 ultrasonic press injury 元件多贴 excessive component 磁头装反 magnetic core inverse 元件漏贴 missing component 错位 wrong position 元件脱落 component break off 输入插头 磁芯不干净 magnetic core dirty 松 input plug loose 输入线头 磁芯破 magnetic core break 断 input wire head breakdown 上下盒不the upper case can't match 磁芯松动 magnetic core loose 吻合 lower case the cover of magentic 磁芯套变形 core deformation 丝印不良 silkscreen NG 插座不良 socket NG 贴错 mount wongly miss inserting 插针漏插 connector 贴反 mount inverse 插座破 connector break 套管破 sleeve tube break 插针倾斜 connector bent 套管松脱 sleeve tube peel off 插针少 lack of connector 脱焊 solder peel off 条码不能 插针松动 connector loose 扫描 barcode can't be scanned 插针歪 connector twist 铜箔断 copper foil broken 对地短路 short to ground 铜箔短路 copper foil short 多垫片 excessive gasket 铜箔开路 copper foil open 电感倾斜 inductor bent 元件掉件 component fall off 钉刮伤 scratched by nail 元件贴翻 component mount inverse 打胶不良 add adhesive NG 烫伤&刮伤 scald&scratch, 短路 short circuit 跳铜皮 copper pad peel off 钉来料不良 incoming nail NG 跳线断 jump wire break off 垫片破损 washer damaged 铜线露出 copper wire come out 多锡 excessive solder 无标记 no mark 多元件,数excessive parts 外壳划伤 case scatched 量多 断柱 column break 底座划伤 base scratch 缝隙过大 big gap the buckle of top case 盖板断扣 broken 高件 component raise up 管脚短 short lead 骨架断钉 bobbin with broken nail 管脚长 longlead 骨架开裂 bobbin crack lead connect with 管脚连铜线 copper wire 外壳沾有异物 case with foreign body 未露管脚 leads hide 无输出 no output 未上锡 no solder 线包不良 wrap NG 线包大 wrap big 小板坏 small board damage 线不良 wire NG 线插错 wire insert wrongly 线断 wire break off 矽钢片变 骨架破损 bobbin broken 形 lamination deformation 矽钢片多insert excessive 骨架烫伤 bobbin scald 插 laminations 挂锡 pending solder 矽钢片松 lamination loose 矽钢片少 光学盒断裂 optics box broken 插 insufficient lamination 矽钢片氧 焊错位 solder wrong position 化 lamination oxidize 焊点不良 solder NG 线刮伤 wire scratched 盒座刮伤 box base with scratch 线焊反 wire solder inverse 后盖划伤 back cover with scratch 线路割错 circuit cut wrongly 焊接不良 defective solder 锡裂 solder crack 盒内有响声 noise in box 线路划伤 circuit scratched 线路开/断 簧片不清洁 spring dirty 路 circuit open 簧片刮伤 spring scratch 线路露铜 copper out of wire 簧片来料不 线路没割良 incoming spring NG 断 circuit no cut off 簧片松 spring loose 线路起泡 circuit blister 氧化 pad oxidize 线没接好 wire connect no well 线内部开 焊盘有绿油 pad with green oil 路 wire open inside 盒座变形 box base deformation 线破皮 insulation of wire broken 盒座来料不良 incoming box base NG 线圈变形 coil deformation 盒座烫伤 box base scald 线头长 wire head long box base assemble 盒座装反 inverse 线头短 wire head short 盒座脏污 box base dirty 线烫伤 wire scald 胶带少缠 tape wrap 线脏污 wire dirty insufficiently 加工反 manufacture inverse 假焊 void solder 结合缝大 connective gap is big 金脚上锡 gold foot wih solder mirror surface with 镜面污点 spot 锡珠&锡渣 solder ball&solder residue 有灰尘 dust 溢胶 adhesive overflow 元件表面脏污 component surface dirty 元件变形 component deformation 元件成型 键盘坏 keyboard brokrn 反 componet moulding inverse 金手指长短the length of gold 元件脚插lead insert to wrong 不一 fingers variance 错位 position 金手指划伤 gold finger scratch 元件脚断 lead broken 金手指上锡 gold finger with solder 元件开路 component open 元件内部 金手指脏 gold finger dirty 短路 component short inside 元件内部 绝缘片破 insulative sheet broken 开路 component open inside 绝缘片歪 insulative sheet bent 元件破损 component damaged 绝缘线破 insulative wire broken 元件贴错 part mount wrongly 接触不良 contact NG 元件贴歪 part mount incline 刻度盘刮伤 dial scratch 元件用错 wrong component 元件一脚 刻度盘黑点 dial macula 未插入 one of lead no insert 刻度盘印刷 元件与散component short with heat 不良 dial print NG 热片短路 sink switch brush 开关刷变形 deformation 元件装反 component assemble inverse 控制面板划 元件阻值伤 control panel scratch 偏差 resistor value deviation 滤波器响 filter with noise 有亮点 light dot LCD with excessive LCD多划 display 压伤 press injury LCD with insufficient LCD少划 display 压铜皮 press copper foil 漏插&漏贴 miss insertion/mounting 有响声 with noise 漏灌胶 missing filling glue 异物 foreign body 支架未装bracket don't be fixed 冷焊 cold solder 到位 correctly 针孔(锡 漏焊 miss soldering 孔) soldering hole 磁芯间有 漏件 miss component 间隙 gap between magnetic cores 来料不良 incoming material NG 装配不良 assemble NG 螺丝不良 screw NG 扎线不符tie out of requirement 合要求 螺丝打错 wrong screw 总装错误 final assemble NG 螺丝漏打 miss screw 绿油掉 green oil peel off 螺丝没打紧 no fasten screw tightly 绿油起泡 green oil blister connect with copper 漏装绝缘miss assembling insulative 连铜皮 foil 片 sheet 漏装塑胶miss assembling the 连锡 solder bridge 上壳 plastic upper case miss assembling magnetic 连锡致短路 solder bridge to short 漏装磁芯 core 尼龙盖破 nylon cover broken